ASUS MB ROG CROSSHAIR X870E HERO BTF AMD X870E AM5 max256GB DDR5 ATX Retail
ASUS MB ROG CROSSHAIR X870E HERO BTF AMD X870E AM5 max256GB DDR5 ATX Retail is backordered and will ship as soon as it is back in stock.
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Tariffs And Fees
Being a Canadian company, our U.S. shipments are subject to tariffs. Under DDP (Delivered Duty Paid), all applicable tariffs and fees are calculated and paid upfront at checkout.
Industrial Automation Parts is only an authorized distributor for DeLock and is not authorized for any other manufacturers. Manufacturer's warranty and support do not apply. Our IAP warranty of three months is applicable.
Country Of Origin: China
AMD X870E (AM5 Socket) ATX motherboard with a hidden-connector design and graphics card high-power slot for clean cable management,, Advanced AI PC-ready, 18+2+2 power stages, Dynamic OC Switcher, Core Flex, DDR5 slots with AEMP & NitroPath DRAM Technology, Wi-Fi 7 with ASUS WiFi Q-Antenna, five M.2 slots onboard, three PCIe® 5.0 M.2 slots onboard, PCIe® 5.0 x16 SafeSlot with PCIe® Slot Q-Release Slim and full support for next-gen graphics cards, two USB4® ports, one USB 20Gbps Type-C® front-panel connectors, AI Overclocking, AI Cooling II, AI Networking II, and Polymo Lighting II
• Ready for Advanced AI PC: Designed for the future of AI computing, with the power and connectivity needed for demanding AI applications
• AMD AM5 Socket: Ready for AMD Ryzen™ 9000 & 8000 & 7000 Series Desktop Processors
• Hidden-Connector Design: Delivers an unprecedented level of cable management to PC DIY enthusiasts
• Graphics Card High-Power Slot: Compatible with the graphics card high-power gold finger on the ASUS BTF graphics card, delivering up to 600 watts through the motherboard
• Intelligent Control: ASUS-exclusive AI Overclocking, AI Cooling II, AI Networking II, and AEMP to simplify setup and improve performance
• ROG Overclocking Technologies: Dynamic OC Switcher, Core Flex, Asynchronous Clock and PBO Enhancement
• Robust Power Solution: 18(110A)+2(110A)+2 power stages with ProCool II power connectors, MicroFine alloy chokes and premium metallic capacitors
• Optimized Thermal Design: Massive heatsinks integrated with the I/O cover, joined by an L-shaped heatpipe and connected to the power stages with high-conductivity thermal pads
• Latest M.2 Support: Three onboard PCIe® 5.0 M.2 slots and two PCIe® 4.0 M.2 slots, all with substantial cooling solutions
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